The increase in complexity and density of integrated circuits brings new manufacturing challenges to the semiconductor industry. Semiconductor wafers for instance see their thickness decrease, use multiple materials, and exhibit smaller feature sizes. Traditional manufacturing methods are reaching their limits. The quality and accuracy of material processing enabled by ultrafast lasers make them a tool of choice for these new applications. In selective ablation processes for instance, it is possible to remove a thin layer of material, a few tens of nanometers thick, without affecting the underlying layer.
In another example, wafer dicing is a process where a full wafer is cut into individual chips. Traditionally performed with a diamond saw, this important manufacturing step benefits from advances in laser processing. As ultrafast laser technology reaches new heights in reliability, robustness and performance, advantages such as higher yield and lower cost of ownership are being realized without sacrificing throughput.
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